US 12,309,962 B2
Configurable multi-chip module heatsink for selective dissipation of heat
William James Anderl, Rochester, MN (US); Alex Matos, Rochester, MN (US); Brenda Berg, Rochester, MN (US); and Kevin O'Connell, Rochester, MN (US)
Assigned to International Business Machines Corporation, Armonk, NY (US)
Filed by International Business Machines Corporation, Armonk, NY (US)
Filed on Mar. 21, 2022, as Appl. No. 17/655,581.
Prior Publication US 2023/0301014 A1, Sep. 21, 2023
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20145 (2013.01) [H05K 7/20309 (2013.01); H05K 7/20336 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A heat sink configured to be attached to and selectively dissipate heat from a plurality of heat-generating components, the heat sink comprising:
a plurality of heat pipes;
a base plate having a top surface and having a bottom surface for attaching to the plurality of heat-generating components, wherein the base plate is configured to locate at least one of the plurality of heat pipes proximate to the plurality of heat-generating components;
a plurality of sets of fins operable to dissipate heat generated by the heat-generating components, wherein the plurality of sets of fins are configured to dissipate heat from one of the plurality of heat-generating components;
a plurality of sets of louvers; and
at least one torsion spring surrounding at least one of the plurality of heat pipes, wherein the at least one torsion spring is configured to expand with heat and activate at least one of the plurality of sets of louvers to open and allow heat to be dissipated from at least one of the plurality of heat-generating components through at least one of the plurality of sets of fins.