US 12,309,954 B1
Protective structures with integrated electrical interconnects for active implantable medical devices
Alexander Loo, Redwood City, CA (US); and Ellen Kaplan, South San Francisco, CA (US)
Assigned to Verily Life Sciences LLC, Dallas, TX (US)
Filed by Verily Life Sciences LLC, South San Francisco, CA (US)
Filed on Sep. 9, 2021, as Appl. No. 17/470,565.
Claims priority of provisional application 63/076,663, filed on Sep. 10, 2020.
Int. Cl. H05K 5/00 (2025.01); H05K 5/02 (2006.01); H05K 5/10 (2025.01)
CPC H05K 5/10 (2025.01) [H05K 5/0026 (2013.01); H05K 5/0086 (2013.01); H05K 5/0247 (2013.01)] 20 Claims
OG exemplary drawing
 
20. A medical device comprising:
a nest housing comprising one or more layers of dielectric material, wherein the one or more layers of dielectric material form an interior surface and an exterior surface of the nest housing;
a component cavity defined by the interior surface;
a first electronic component disposed within the component cavity;
a second electronic component disposed within the component cavity;
an electrical interconnect formed on or embedded within the one or more layers of dielectric material;
a casing formed around the nest housing to completely enclose the nest housing;
a first electrical contact disposed between the electrical interconnect and the first electronic component; and
a second electrical contact disposed between the electrical interconnect and the second electronic component,
wherein the electrical interconnect electrically connects the first electronic component and the second electronic component via the first electrical contact and the second electrical contact.