| CPC H05K 3/20 (2013.01) [H05K 1/111 (2013.01); H05K 1/118 (2013.01)] | 7 Claims |
|
1. A flexible electronic device, including:
a flexible substrate having a surface;
a plurality of first pads disposed on the surface and having a first side surface and a second side surface;
an insulating layer disposed on the surface, wherein the insulating layer is disposed between two adjacent first pads of the plurality of first pads and contacts the first side surface and the second side surface,
a substrate disposed on the surface;
a plurality of second pads disposed between the surface and the substrate;
an insulating column disposed between the two adjacent first pads and disposed between the flexible substrate and the substrate; and
a conductive adhesive disposed on the substrate and between the two adjacent first pads of the plurality of first pads;
wherein the insulating layer has a first maximum height in a normal direction of the surface, at least one of the plurality of first pads has a second maximum height in the normal direction of the surface, and the first maximum height is less than or equal to the second maximum height;
wherein the at least one of the plurality of first pads is electrically connected to one of the plurality of second pads, and a length of the one of the plurality of second pads is different from a length of the at least one of the plurality of first pads in a cross section view;
wherein in the normal direction of the surface, the insulating layer and the plurality of first pads are overlapped.
|