US 12,309,933 B2
Magnetically secured semiconductor chip package loading assembly
Phil Geng, Washougal, WA (US); Timothy Glen Hanna, Tigard, OR (US); Xiaoning Ye, Portland, OR (US); Sandeep Ahuja, Portland, OR (US); Jacob McMillian, Beaverton, OR (US); Ralph V. Miele, Hillsboro, OR (US); David Shia, Portland, OR (US); and Jeffory L. Smalley, Olympia, WA (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Jul. 20, 2021, as Appl. No. 17/381,092.
Prior Publication US 2021/0378099 A1, Dec. 2, 2021
Int. Cl. H05K 1/00 (2006.01); H01L 23/367 (2006.01); H01L 23/40 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 7/20 (2006.01)
CPC H05K 1/181 (2013.01) [H01L 23/3675 (2013.01); H01L 23/40 (2013.01); H05K 1/0203 (2013.01); H05K 7/2039 (2013.01); H05K 2201/08 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a heat sink;
a printed circuit board having a first side and a second side wherein the first side is opposite the second side;
a semiconductor chip package;
a first magnetic material, wherein the first magnetic material is mechanically coupled to the first side of the printed circuit board, wherein input/outputs (I/Os) of said semiconductor chip package interface with said printed circuit board; and
a second magnetic material wherein said heat sink, said printed circuit board, said first magnetic material, and said second magnetic material are in a stacked configuration, wherein said first magnetic material is sandwiched between said printed circuit board and said second magnetic material in said stacked configuration, and wherein said first magnetic material is magnetically attracted to said second magnetic material.