US 12,309,932 B2
Electronic component module, sub-module, and method for manufacturing same
Tsuyoshi Takakura, Nagaokakyo (JP); Yoshihito Otsubo, Nagaokakyo (JP); Tadashi Nomura, Nagaokakyo (JP); and Hideo Nakagoshi, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed on Apr. 11, 2023, as Appl. No. 18/298,451.
Application 18/298,451 is a continuation of application No. PCT/JP2021/037713, filed on Oct. 12, 2021.
Claims priority of application No. 2020-174835 (JP), filed on Oct. 16, 2020.
Prior Publication US 2023/0309230 A1, Sep. 28, 2023
Int. Cl. H05K 1/18 (2006.01); H01L 23/552 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01L 25/16 (2023.01); H05K 3/32 (2006.01); H05K 3/34 (2006.01); H05K 9/00 (2006.01); H01L 23/00 (2006.01)
CPC H05K 1/18 (2013.01) [H01L 23/552 (2013.01); H01L 25/0657 (2013.01); H01L 25/162 (2013.01); H01L 25/50 (2013.01); H05K 3/321 (2013.01); H05K 3/34 (2013.01); H05K 9/0022 (2013.01); H01L 24/16 (2013.01); H01L 2224/16237 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/1006 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10515 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/1053 (2013.01)] 3 Claims
OG exemplary drawing
 
1. An electronic component module comprising:
a substrate;
an electronic component mounted on the substrate;
a sub-module mounted on the substrate, the sub-module including a wiring board having two main surfaces, a first electronic component disposed on one of the two main surfaces of the wiring board, a second electronic component disposed on another one of the two main surfaces of the wiring board, and a first sealing member covering the wiring board, the first electronic component, and the second electronic component; and
a second sealing member covering both the sub-module and another electronic component different from both of the first electronic component and the second electronic component,
wherein a first shield film is provided on a surface of the first sealing member of the sub-module,
wherein a second shield film is provided on a surface of the second sealing member,
wherein one of the first electronic component and the second electronic component is in direct contact with the second shield film,
wherein the first shield film is interposed between the electronic component and the first and second electronic components, and
wherein a top surface of the second sealing member, an upper edge of the first shield film, a top surface of the first sealing member, and a top surface of the first electronic component are positioned on the same plane.