US 12,309,926 B2
Electronic apparatus
Jaejin Oh, Gwangju (KR); Junho Kwack, Chungcheongnam-do (KR); Dongjin Park, Seongnam-si (KR); Kyung-Mok Lee, Seoul (KR); and Dong-Youb Lee, Cheonan-si (KR)
Assigned to Samsung Display Co., Ltd., Yongin-si (KR)
Filed by Samsung Display Co., Ltd., Yongin-Si (KR)
Filed on Dec. 29, 2023, as Appl. No. 18/400,347.
Application 18/400,347 is a continuation of application No. 17/562,493, filed on Dec. 27, 2021, granted, now 11,895,774.
Claims priority of application No. 10-2021-0026201 (KR), filed on Feb. 26, 2021.
Prior Publication US 2024/0138065 A1, Apr. 25, 2024
Int. Cl. H05K 1/11 (2006.01); G01R 27/08 (2006.01); H01L 27/12 (2006.01); H05K 1/02 (2006.01)
CPC H05K 1/118 (2013.01) [G01R 27/08 (2013.01); H01L 27/124 (2013.01); H05K 1/0268 (2013.01); H05K 2201/10128 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic apparatus comprising:
an electronic panel comprising a base substrate, a plurality of pixels on the base substrate, and a plurality of pads in an adhesive area, the plurality of pads is spaced apart from the plurality of pixels;
a circuit board comprising a plurality of leads; and
wherein the plurality of pads comprises a plurality of pixel pads electrically connected to the plurality of pixels, an arrangement pad spaced apart from the plurality of pixel pads, and a resistance measurement pad disposed between the arrangement pad and the plurality of pixels pads and insulated from the plurality of pixel pads, and
wherein the plurality of leads comprises a plurality of resistance measurement leads electrically connected to the resistance measurement pad and a dummy lead spaced apart from each of the plurality of resistance measurement leads in the plan view.