US 12,309,924 B2
Connection structure embedded substrate and substrate structure including the same
Tae Hong Min, Suwon-si (KR); Ho Hyung Ham, Suwon-si (KR); Yong Soon Jang, Suwon-si (KR); Ki Suk Kim, Suwon-si (KR); Hyung Ki Lee, Suwon-si (KR); and Chi Won Hwang, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Apr. 25, 2023, as Appl. No. 18/138,901.
Application 18/138,901 is a division of application No. 17/371,813, filed on Jul. 9, 2021, granted, now 11,737,211.
Claims priority of application No. 10-2021-0041112 (KR), filed on Mar. 30, 2021.
Prior Publication US 2023/0262891 A1, Aug. 17, 2023
Int. Cl. H05K 1/11 (2006.01); G06F 1/18 (2006.01)
CPC H05K 1/115 (2013.01) [G06F 1/189 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/041 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A connection structure embedded substrate comprising:
a printed circuit board including a plurality of first insulating layers and a plurality of first wiring layers, respectively disposed on or between the plurality of first insulating layers; and
a connection structure disposed in the printed circuit board and including a plurality of internal insulating layers and a plurality of internal wiring layers, respectively disposed on or between the plurality of internal insulating layers,
wherein among the plurality of internal wiring layers, an internal wiring layer disposed in one surface of the connection structure is in contact with one surface of a first insulating layer, among the plurality of first insulating layers, and
a second insulating layer different from the first insulating layer, among the plurality of first insulating layers, covers and is in contact with a side surface of the connection structure, the side surface of the connection structure extending from the one surface of the connection structure.