	US 12,309,923 B2
	Printed circuit board and method for manufacturing the same
Sang Hoon Kim, Suwon-si (KR); Young Kuk Ko, Suwon-si (KR); Gyu Mook Kim, Suwon-si (KR); Hea Sung Kim, Suwon-si (KR); Chi Won Hwang, Suwon-si (KR); and Suk Chang Hong, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on May 10, 2022, as Appl. No. 17/740,781.
Claims priority of application No. 10-2021-0184734 (KR), filed on Dec. 22, 2021.
Prior Publication US 2023/0199956 A1, Jun. 22, 2023
Int. Cl. H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01)

CPC H05K 1/115 (2013.01) [H05K 1/0298 (2013.01); H05K 1/188 (2013.01); H05K 3/30 (2013.01); H05K 2201/10734 (2013.01)]

35 Claims

1. A printed circuit board comprising:

an insulating member including a cavity;

a first bump disposed on the insulating member;

a second bump disposed adjacently to but spaced apart from the first bump on the insulating member;

a first insulating wall covering at least a portion of the first bump; and

a second insulating wall covering at least a portion of the second bump and disposed adjacently to but spaced apart from the first insulating wall,

wherein the printed circuit board includes a center region in which the cavity of the insulating member is disposed and a side region surrounding the center region in plan view, and the first and second bumps and the first and second insulating walls are disposed in the side region.