US 12,309,920 B2
Wiring substrate
Shogo Fukui, Ogaki (JP); Kosuke Ikeda, Ogaki (JP); Kosei Ichikawa, Ogaki (JP); and Ryo Ando, Ogaki (JP)
Assigned to IBIDEN CO., LTD., Ogaki (JP)
Filed by IBIDEN CO., LTD., Gifu (JP)
Filed on Dec. 6, 2022, as Appl. No. 18/062,049.
Claims priority of application No. 2021-198078 (JP), filed on Dec. 6, 2021.
Prior Publication US 2023/0180385 A1, Jun. 8, 2023
Int. Cl. H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01)
CPC H05K 1/0373 (2013.01) [H05K 1/112 (2013.01); H05K 3/4661 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0263 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A wiring substrate, comprising:
an insulating layer comprising inorganic filler particles and resin; and
a conductor layer comprising a metal film formed on a surface of the insulating layer and having a conductor pattern,
wherein the inorganic filler particles include first inorganic filler particles such that each of the first inorganic filler particles has an exposed portion exposed from the surface of the insulating layer and is at least partially separated from the resin, and the conductor layer is formed such that a part of the metal film is penetrating in a gap or gaps formed between the exposed portion of each of the first inorganic filler particles and the resin forming the surface of the insulating layer and that a distance between the surface of the insulating layer and the surface of the insulating layer at a deepest part of the part of the metal film is in a range of 0.1 μm to 0.5 μm.