US 12,309,919 B2
Laminate, single-sided metal-clad laminated sheet, and multi-layer printed wiring board
Kanji Shimoosako, Otsu (JP); Kentaro Tsukuya, Otsu (JP); Hitoshi Yasuhira, Otsu (JP); and Konoshin Fujimoto, Otsu (JP)
Assigned to KANEKA CORPORATION, Osaka (JP)
Filed by KANEKA CORPORATION, Osaka (JP)
Filed on Dec. 8, 2022, as Appl. No. 18/063,666.
Application 18/063,666 is a continuation of application No. PCT/JP2021/020857, filed on Jun. 1, 2021.
Claims priority of application No. 2020-099350 (JP), filed on Jun. 8, 2020.
Prior Publication US 2023/0106839 A1, Apr. 6, 2023
Int. Cl. H05K 1/03 (2006.01)
CPC H05K 1/036 (2013.01) [H05K 1/0393 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0355 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A laminate comprising:
a multi-layer polyimide film including a non-thermoplastic polyimide film having a first principal surface and a second principal surface, a first thermoplastic polyimide layer disposed on the first principal surface of the non-thermoplastic polyimide film, and a second thermoplastic polyimide layer disposed on the second principal surface of the non-thermoplastic polyimide film; and
a surface layer contacting the second thermoplastic polyimide layer of the multi-layer polyimide film,
wherein the surface layer is an inorganic layer having a thickness of 1 to 200 nm.