| CPC H05K 1/0298 (2013.01) [H05K 1/184 (2013.01); H05K 2201/10651 (2013.01)] | 9 Claims |

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1. A circuit board, comprising:
a first electronic component comprising two electrodes;
a circuit substrate comprising:
an inner substrate defining a receiving cavity, the first electronic component received in the receiving cavity such that each of the two electrodes faces an inner sidewall of the receiving cavity, the inner substrate comprising a first insulating layer and a blocking layer embedded in the first insulating layer, a melting point of a material of the blocking layer being higher than a melting point of a material of the first insulating layer, an end of the blocking layer being exposed from the inner sidewall; and
an outer substrate formed on the inner substrate and covering the receiving cavity, the outer substrate defining two through holes; wherein in a direction of a center axis of each of the two through holes, each of the two through holes extends through a portion of the first insulating layer which is connected to the inner sidewall; along the direction of the center axis, each of the two through holes further extends through a portion of the blocking layer, the blocking layer is configured to limit a depth of each of the two through holes, such that a remaining portion of the blocking layer is exposed from a bottom end of each of the two through holes, a top end of each of the two electrodes facing the outer substrate is partially received in the bottom end of a respective one of the two through holes.
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