| CPC H05K 1/0274 (2013.01) [H05K 1/028 (2013.01); H05K 3/103 (2013.01); H05K 3/4626 (2013.01); H05K 2201/095 (2013.01); H05K 2201/10121 (2013.01)] | 8 Claims |
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1. A package for an optical module comprising:
a side wall; and
a substrate provided through the side wall in a first direction, the substrate including
a first wiring layer that is externally exposed, the first wiring layer including
a first signal terminal extending along the first direction,
a second signal terminal extending along the first direction, and
a first ground terminal extending along the first direction, the first ground terminal being provided between the first signal terminal and the second signal terminal, when viewed in a second direction perpendicular to the first direction,
a second wiring layer disposed under the first wiring layer, the second wiring layer including a first ground pattern, the first ground pattern being electrically coupled to the first ground terminal via a plurality of first vias,
a third wiring layer disposed under the second wiring layer, the third wiring layer including
a second ground layer electrically coupled to the first ground pattern via a plurality of second vias and a plurality of third vias;
a first insulating layer disposed between the first wiring layer and the second wiring layer, the first insulating layer including the plurality of first vias, the plurality of first vias being arranged at a first interval along the first direction, and
a second insulating layer disposed between the second wiring layer and the third wiring layer, the second insulating layer including
the plurality of second vias, the second vias being arranged at a second interval along the first direction, and
the plurality of third vias, the third vias being arranged at the second interval along the first direction,
wherein when viewed in the second direction, each first via of the plurality of first vias is provided between a corresponding second via among the plurality of second vias and a corresponding third via among the plurality of third vias, and
wherein when viewed in the first direction, each second via of the plurality of second vias is disposed at an offset by half of the second interval from the corresponding third via among the plurality of third vias.
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