| CPC H05K 1/0218 (2013.01) [H05K 1/181 (2013.01); H05K 2201/1003 (2013.01)] | 20 Claims |

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1. A multilayer circuit board having a signal and power isolation circuit, comprising:
a microstrip line on a component mounting surface;
a mounting pad on the microstrip line and having a wider width than a line width of the microstrip line;
at least one chip inductor mounted on the component mounting surface and electrically connected between the mounting pad and a power supply;
an inductor characteristic compensation portion having a predetermined area in a mounting-surface-below portion of an inner-layer ground disposed immediately below the component mounting surface, the mounting-surface-below portion of the inner-layer ground being situated immediately below the chip inductor; and
a signal transmission characteristic compensation portion having a predetermined area in a portion of the inner-layer ground, the portion of the inner-layer ground being situated immediately below the mounting pad, at a position separated from the inductor characteristic compensation portion by a predetermined distance such that the signal transmission characteristic compensation portion is electrically isolated from the inductor characteristic compensation portion.
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