US 12,309,913 B2
Module
Yoshihito Otsubo, Nagaokakyo (JP); Ryoichi Kita, Nagaokakyo (JP); and Tadashi Nomura, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Sep. 28, 2022, as Appl. No. 17/936,051.
Application 17/936,051 is a continuation of application No. PCT/JP2021/013334, filed on Mar. 29, 2021.
Claims priority of application No. 2020-069216 (JP), filed on Apr. 7, 2020.
Prior Publication US 2023/0015008 A1, Jan. 19, 2023
Int. Cl. H05K 1/02 (2006.01); H01L 21/56 (2006.01); H01L 21/762 (2006.01); H01L 23/00 (2006.01); H01L 23/12 (2006.01); H01L 23/28 (2006.01); H01L 23/31 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01L 25/04 (2023.01); H01L 25/16 (2023.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01); H05K 7/20 (2006.01); H05K 9/00 (2006.01)
CPC H05K 1/0216 (2013.01) [H05K 1/0243 (2013.01); H05K 2201/10098 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A module comprising:
a substrate having a first face;
a plurality of components mounted on the first face;
a resin film covering the plurality of components along contours of the plurality of components and also covering a part of the first face; and
a shield film provided to overlap the resin film,
wherein the first face is provided with a ground electrode,
the resin film has an opening,
the shield film is connected to the ground electrode via the opening,
the shield film has a dot-shaped recess corresponding to the opening,
the shield film is separated by a slit, and wherein the first face of the substrate is exposed to an outside of said module via said slit, and
the slit is provided in a region where a two-layer structure comprising the resin film and the shield film covers the first face of the substrate directly.