| CPC H05K 1/0209 (2013.01) [H05K 7/20336 (2013.01); H05K 2201/064 (2013.01); H05K 2201/066 (2013.01)] | 7 Claims |

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1. A method for making an electronic module to be mounted within a chassis, the method comprising:
3D printing a heat sink body by Fused Deposition Modeling (FDM);
coupling the 3D printed heat sink body to a plurality of heat-generating electronic components on a circuit substrate, the 3D printed heat sink body having opposing ends and opposing side edges extending between the opposing ends, the 3D printed heat sink body having a plurality of heat pipe receiving passageways extending therethrough between opposing side edges and overlying corresponding ones of the heat-generating components;
3D printing a plurality of heat pipes by FDM; and
fastening a respective 3D printed heat pipe extending within each heat pipe receiving passageway.
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