US 12,309,911 B2
Printed circuit board (PCB) cooling
Yongduk Lee, Vernon, CT (US); Parag M. Kshirsagar, South Windsor, CT (US); and Ankit Gupta, Willimantic, CT (US)
Assigned to Hamilton Sundstrand Corporation, Charlotte, NC (US)
Filed by Hamilton Sundstrand Corporation, Charlotte, NC (US)
Filed on Jul. 11, 2022, as Appl. No. 17/861,584.
Prior Publication US 2024/0015881 A1, Jan. 11, 2024
Int. Cl. H05K 1/02 (2006.01); H05K 1/14 (2006.01)
CPC H05K 1/0209 (2013.01) [H05K 1/144 (2013.01); H05K 2201/042 (2013.01); H05K 2201/064 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A printed circuit board (PCB) assembly comprising:
a first PCB including at least one heat generating component;
a second PCB mounted to the first PCB, wherein the second PCB defines a cooling path therein extending in a coolant flow direction from an inlet end of the cooling path to an outlet end of the cooling path;
a plurality of power pillars extending from the first PCB and across the cooling path; and
a third PCB, wherein the third PCB is mounted to the second PCB opposite from the first PCB, wherein the cooling path is enclosed between the first and third PCBs and a perimeter of the second PCB.