US 12,309,910 B2
Point of load module and heatsink therefor
John Andrew Trelford, Richardson, TX (US); Alok K. Lohia, Dallas, TX (US); and Arturo Silva, Allen, TX (US)
Assigned to AcLeap Power Inc., Taipei (TW)
Filed by AcLeap Power Inc., Taipei (TW)
Filed on Jan. 2, 2024, as Appl. No. 18/402,206.
Application 18/402,206 is a continuation of application No. 17/550,707, filed on Dec. 14, 2021, granted, now 11,910,517.
Prior Publication US 2024/0138051 A1, Apr. 25, 2024
Int. Cl. H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 7/20 (2006.01)
CPC H05K 1/0203 (2013.01) [H05K 1/141 (2013.01); H05K 1/181 (2013.01); H05K 7/2039 (2013.01); H05K 2201/1003 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system, comprising:
a module, comprising:
a first printed circuit board (PCB) electrically defining a power network, wherein the first PCB has a first side and a second side opposing the first side, and wherein the second side is configured to be surface mounted to a second PCB to electrically connect the power network to first and second electrically conductive pads on the second PCB; and
at least one electrical component mounted to the first side of the first PCB; and
a heat sink, comprising:
a first leg configured to be surface mounted to the first electrically conductive pad on the second PCB adjacent to the first PCB;
at least one second leg opposite the first leg and configured to be surface mounted to the second electrically conductive pad on the second PCB adjacent to the first PCB; and
a cap portion connecting the first leg to the at least one second leg,
wherein the heat sink is sized and shaped to at least partially encompass the module, and
wherein the heat sink is configured to electrically connect to the power network of the first PCB via the first and second electrically conductive pads on the second PCB.