US 12,309,907 B2
Electronic device and manufacturing method of electronic device
Yorioki Matsumoto, Koshu (JP); Nobuhiro Matsumoto, Koshu (JP); Shinichi Yamaguchi, Tokyo (JP); and Ryuichi Takeuchi, Tokyo (JP)
Assigned to MATSUMOTO GIKEN CO., LTD., Koshu (JP); and SHISHIDO ELECTROSTATIC, LTD., Tokyo (JP)
Appl. No. 18/010,629
Filed by MATSUMOTO GIKEN CO., LTD., Koshu (JP); and SHISHIDO ELECTROSTATIC, LTD., Tokyo (JP)
PCT Filed Jun. 16, 2021, PCT No. PCT/JP2021/022887
§ 371(c)(1), (2) Date Dec. 15, 2022,
PCT Pub. No. WO2021/256513, PCT Pub. Date Dec. 23, 2021.
Claims priority of application No. 2020-104857 (JP), filed on Jun. 17, 2020.
Prior Publication US 2023/0345608 A1, Oct. 26, 2023
Int. Cl. H05F 1/02 (2006.01); H01T 19/00 (2006.01)
CPC H05F 1/02 (2013.01) [H01T 19/00 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An electronic device that is used around a neutralization target object, the electronic device comprising:
an electric part;
an interconnection portion that transmits electric power of a high voltage power supply to the electric part; and
a housing that accommodates the electric part and the interconnection portion,
wherein the electronic device includes at least one of a cover portion, which covers at least a part of the electric part and has a surface resistivity of equal to or higher than 104Ω/□ and equal to or lower than 1011Ω/□, and the housing, which has a surface resistivity of equal to or higher than 104Ω/□ and equal to or lower than 1011Ω/□, and
wherein at least one of the housing and the cover portion includes a layer that has an insulation property or a conductive property, and an electrostatic dissipation layer that is formed on at least a part of a surface of the layer and that has a surface resistivity of equal to or higher than 104Ω/□ and equal to or lower than 1011Ω/□.