US 12,308,889 B2
Modular quantum interconnect for microwave and telecommunications wavelengths
Jonas Nils Becker, Lansing, MI (US); Shannon Singer Nicley, Lansing, MI (US); and Johannes Pollanen, Lansing, MI (US)
Assigned to Board of Trustees of Michigan State University, East Lansing, MI (US)
Filed by Board of Trustees of Michigan State University, East Lansing, MI (US)
Filed on Feb. 22, 2023, as Appl. No. 18/172,441.
Claims priority of provisional application 63/312,893, filed on Feb. 23, 2022.
Prior Publication US 2024/0171289 A1, May 23, 2024
Int. Cl. H04B 10/70 (2013.01); G02F 1/21 (2006.01); G02F 1/225 (2006.01); H01P 3/00 (2006.01); H01P 7/00 (2006.01)
CPC H04B 10/70 (2013.01) [G02F 1/212 (2021.01); G02F 1/2255 (2013.01); H01P 3/003 (2013.01); H01P 7/00 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A quantum interconnect module comprising:
a quantum memory comprising a dual arm interferometer embedded therein, said dual arm interferometer comprising a first arm within a crystal and a second arm within the crystal, said interferometer coupled to a photon source;
a microwave resonator comprising a waveguide coupled to a microwave source, said microwave resonator coupled to the first arm of the quantum memory; and
said interferometer generating an output based the microwave source.