US 12,308,828 B2
Radio-frequency module and communication device
Keisuke Nishio, Kyoto (JP); Yukiteru Sugaya, Kyoto (JP); Masaki Tada, Kyoto (JP); Masanori Kato, Kyoto (JP); Syunsuke Kido, Kyoto (JP); and Hiroshi Matsubara, Kyoto (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed on Aug. 11, 2022, as Appl. No. 17/818,990.
Claims priority of application No. 2021-168437 (JP), filed on Oct. 13, 2021.
Prior Publication US 2023/0112175 A1, Apr. 13, 2023
Int. Cl. H03H 9/72 (2006.01); H03H 9/02 (2006.01); H04B 1/40 (2015.01)
CPC H03H 9/725 (2013.01) [H03H 9/02015 (2013.01); H04B 1/40 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A radio-frequency module comprising:
a mounting substrate having a first major surface and a second major surface facing each other;
a first signal terminal, a second signal terminal, and a ground terminal disposed on the second major surface of the mounting substrate;
a hybrid filter connected between the first signal terminal and the second signal terminal and including an acoustic wave filter having at least one acoustic wave resonator, an inductor having a winding portion, and a capacitor;
a resin layer disposed on the first major surface of the mounting substrate and covering at least part of the acoustic wave filter and the inductor; and
a metal electrode layer covering at least part of the resin layer and at least part of an outer periphery of the mounting substrate and connected to the ground terminal, wherein:
the acoustic wave filter includes a plurality of outer electrodes connected to the first major surface of the mounting substrate,
the plurality of outer electrodes includes a first input and output electrode connected to the first signal terminal, a second input and output electrode connected to the second signal terminal, and a ground electrode connected to the ground terminal,
the inductor is disposed on the first major surface of the mounting substrate and is adjacent to the acoustic wave filter in plan view in a thickness direction of the mounting substrate, and
when viewed in a direction of a winding axis of the winding portion of the inductor, an inner part of the winding portion in the inductor does not overlap any of the first input and output electrode, the second input and output electrode, and the ground electrode.