US 12,308,811 B2
Method of manufacturing a cap substrate for acoustic wave device
Wilfred Ryan Vidamo Habana, Singapore (SG); Hidekazu Nakanishi, Sakai (JP); XiaoJun Chew, Singapore (SG); and Mitsuhiro Furukawa, Nishinomiya (JP)
Assigned to Skyworks Solutions, Inc., Irvine, CA (US)
Filed by Skyworks Solutions, Inc., Irvine, CA (US)
Filed on Apr. 6, 2022, as Appl. No. 17/658,190.
Claims priority of provisional application 63/201,225, filed on Apr. 19, 2021.
Claims priority of provisional application 63/201,223, filed on Apr. 19, 2021.
Prior Publication US 2022/0337213 A1, Oct. 20, 2022
Int. Cl. H03H 3/02 (2006.01); H03H 9/10 (2006.01); H03H 9/54 (2006.01)
CPC H03H 3/02 (2013.01) [H03H 9/105 (2013.01); H03H 9/54 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method of manufacturing a packaged acoustic wave component, the method comprising:
forming or providing a non-metal cap substrate;
forming a metal layer on a surface of the cap substrate;
marking the metal layer with one or more alphanumeric indicia made on the metal layer; and
bonding the cap substrate to a device substrate that has an acoustic wave device on a surface thereof such that the metal layer is spaced from and faces the acoustic wave device.