US 12,308,809 B2
Power amplification circuit
Shigeki Koya, Kyoto (JP); and Takayuki Tsutsui, Kyoto (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed on Aug. 30, 2021, as Appl. No. 17/460,543.
Claims priority of application No. 2020-161705 (JP), filed on Sep. 28, 2020.
Prior Publication US 2022/0103143 A1, Mar. 31, 2022
Int. Cl. H03F 3/68 (2006.01); H03F 1/56 (2006.01); H03F 3/195 (2006.01); H03F 3/24 (2006.01); H03F 3/72 (2006.01)
CPC H03F 3/72 (2013.01) [H03F 1/565 (2013.01); H03F 3/195 (2013.01); H03F 3/245 (2013.01); H03F 2200/168 (2013.01); H03F 2200/318 (2013.01); H03F 2200/451 (2013.01); H03F 2203/7215 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A power amplification circuit comprising:
a first wiring configured to receive a first signal having a first frequency;
a second wiring configured to receive a second signal having a second frequency, the first frequency band being higher than the second frequency;
a first amplification circuit configured to amplify the first signal having the first frequency with a pre-gain and to output a first amplified signal with the pre-gain to the second wiring, the first amplified signal being supplied to the first amplification circuit through the first wiring;
a second amplification circuit configured to receive the first amplified signal and the second signal supplied through the second wiring, and configured to amplify the first amplified signal and the second signal with a main gain to output a second amplified signal; and
a third filter configured to attenuate a frequency component outside of a first frequency band that includes the first frequency, the third filter being in-line with the first wiring.