US 12,308,538 B2
PCB terminal, connector, wiring harness with connector and board unit
Michitake Kamamoto, Mie (JP); Kingo Furukawa, Mie (JP); Yoshifumi Saka, Mie (JP); and Hajime Watanabe, Mie (JP)
Assigned to AUTONETWORKS TECHNOLOGIES, LTD., Mie (JP); SUMITOMO WIRING SYSTEMS, LTD., Mie (JP); and SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
Appl. No. 17/911,887
Filed by AUTONETWORKS TECHNOLOGIES, LTD., Mie (JP); SUMITOMO WIRING SYSTEMS, LTD., Mie (JP); and SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
PCT Filed Mar. 24, 2021, PCT No. PCT/JP2021/012430
§ 371(c)(1), (2) Date Sep. 15, 2022,
PCT Pub. No. WO2021/193781, PCT Pub. Date Sep. 30, 2021.
Claims priority of application No. 2020-056657 (JP), filed on Mar. 26, 2020.
Prior Publication US 2023/0130798 A1, Apr. 27, 2023
Int. Cl. H01R 12/58 (2011.01); C25D 3/12 (2006.01); C25D 3/30 (2006.01); C25D 3/58 (2006.01); C25D 3/60 (2006.01); C25D 5/12 (2006.01); C25D 7/00 (2006.01); H01R 13/03 (2006.01); H01R 43/16 (2006.01)
CPC H01R 12/58 (2013.01) [C25D 3/12 (2013.01); C25D 3/30 (2013.01); C25D 3/58 (2013.01); C25D 3/60 (2013.01); C25D 5/12 (2013.01); C25D 7/00 (2013.01); H01R 13/03 (2013.01); H01R 43/16 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A PCB terminal, comprising:
a rod-like base material; and
a plating layer covering a predetermined region of the base material,
wherein:
a constituent material of the base material is a copper alloy containing 20% by mass or more of zinc,
the plating layer includes a first coating portion and a second coating portion,
the first coating portion includes an entire peripheral layer entirely covering a region on side of a first end part, out of both end parts of the base material, in a circumferential direction of the base material,
the second coating portion partially covers a region on side of a second end part, out of the both end parts of the base material, in the circumferential direction of the base material,
the entire peripheral layer includes a tin-based layer and a barrier layer,
the tin-based layer includes a pure tin layer constituting an outermost surface of the first coating portion, and
a constituent material of the barrier layer is pure nickel or a copper-tin alloy containing copper and tin.