US 12,308,510 B2
Terahertz band waveguide module and mounting method of IC chip
Moonil Kim, Seoul (KR)
Assigned to Korea University Research and Business Foundation, Seoul (KR)
Filed by KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION, Seoul (KR)
Filed on Dec. 22, 2022, as Appl. No. 18/086,852.
Claims priority of application No. 10-2022-0085563 (KR), filed on Jul. 12, 2022.
Prior Publication US 2024/0021999 A1, Jan. 18, 2024
Int. Cl. H01Q 1/22 (2006.01); H01P 3/12 (2006.01); H01Q 9/16 (2006.01); H01Q 13/06 (2006.01); H01Q 23/00 (2006.01)
CPC H01Q 1/2283 (2013.01) [H01P 3/12 (2013.01); H01Q 9/16 (2013.01); H01Q 13/06 (2013.01); H01Q 23/00 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A waveguide module comprising:
a waveguide channel having a channel size of a first size based on an E-plane; and
an integrated circuit (IC) chip having a width of a second size and disposed at a predetermined position inside the waveguide channel,
wherein the IC chip is disposed inside the waveguide channel with air gaps outside the IC chip;
wherein the air gaps are set to 30 μm or less; and
wherein the IC chip includes a dipole antenna.