US 12,308,364 B2
Power module package for direct cooling multiple power modules
Jerome Teysseyre, Singapore (SG); Inpil Yoo, Unterhaching (DE); and Jooyang Eom, Gimpo-si (KR)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed on Dec. 15, 2023, as Appl. No. 18/542,230.
Application 17/822,844 is a division of application No. 16/949,896, filed on Nov. 19, 2020, granted, now 11,430,777, issued on Aug. 30, 2022.
Application 18/542,230 is a continuation of application No. 17/822,844, filed on Aug. 29, 2022, granted, now 11,848,320.
Prior Publication US 2024/0120328 A1, Apr. 11, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 25/00 (2006.01); H01L 23/367 (2006.01); H01L 23/467 (2006.01); H01L 23/473 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2023.01)
CPC H01L 25/50 (2013.01) [H01L 23/3677 (2013.01); H01L 23/467 (2013.01); H01L 23/473 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A power module package for direct cooling multiple power modules, the power module package comprising:
a plurality of power modules including a first power module and a second power module;
a plurality of heat sinks including a first heat sink coupled to the first power module and a second heat sink coupled to the second power module; and
a module carrier coupled to the plurality of power modules, the module carrier including a first region defining a first heat-sink slot and a second region defining a second heat-sink slot, the first heat sink extending at least partially through the first heat-sink slot, the second heat sink extending at least partially through the second heat-sink slot.