US 12,308,340 B2
Thermocompression apparatus and method for bonding electrical components to a substrate
Benjamin Holzner, Oberviechtach (DE); and Uwe Franz Augst, Wackersdorf (DE)
Assigned to MB AUTOMATION GmbH & Co. KG, Roding (DE)
Appl. No. 18/254,633
Filed by MB AUTOMATION Gmbh & Co. KG, Roding (DE)
PCT Filed Oct. 22, 2021, PCT No. PCT/EP2021/079313
§ 371(c)(1), (2) Date May 26, 2023,
PCT Pub. No. WO2022/111917, PCT Pub. Date Jun. 2, 2022.
Claims priority of application No. 10 2020 007 235.6 (DE), filed on Nov. 26, 2020.
Prior Publication US 2024/0421118 A1, Dec. 19, 2024
Int. Cl. H01L 21/00 (2006.01); H01L 23/00 (2006.01)
CPC H01L 24/75 (2013.01) [H01L 2224/45301 (2013.01); H01L 2224/75251 (2013.01); H01L 2224/7555 (2013.01); H01L 2224/7592 (2013.01)] 25 Claims
OG exemplary drawing
 
1. A thermocompression apparatus for connecting electrical components to a substrate, comprising:
a lower tool with a support surface for supporting the substrate with at least one electrical component arranged thereon, and
an upper tool with a pressing element facing the support surface of the lower tool, wherein
the lower tool and the upper tool are movable relative to each other in an open/close movement, wherein
the lower tool and/or the upper tool are set up,
to perform the open/close movement by a first drive and a second drive, wherein
the first drive is arranged to execute a first movement in a first stroke range, the first movement having an acceleration section and a high-speed section and a deceleration section, and
the second drive is arranged to execute a second movement in a second stroke range, wherein the second movement has an acceleration section and a high-speed section and a deceleration section, and wherein
a movement speed during the high-speed portion of the first movement is lower than a movement speed during the high-speed portion of the second movement, and
the first stroke range is greater than the second stroke range, and wherein
the lower tool or the upper tool carries a thermode assembly which is associated with the support surface and/or the pressing element and which is arranged to feed heating energy into the component and/or the substrate in order to thermally cure an adhesive introduced between the component and the substrate.