| CPC H01L 23/535 (2013.01) [H01L 21/76805 (2013.01); H01L 21/76816 (2013.01); H01L 21/76831 (2013.01); H01L 21/76843 (2013.01); H01L 21/76895 (2013.01); H01L 23/5283 (2013.01)] | 21 Claims |
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1. A semiconductor device comprising:
an etching stop film disposed on a substrate;
an interlayer insulating film on the etching stop film;
a first trench and a second trench which are spaced apart in a first direction, and penetrate the etching stop film and the interlayer insulating film, the first trench having a side wall that exposes the interlayer insulating film, and the second trench having a side wall that exposes the interlayer insulating film;
a first spacer which covers the interlayer insulating film exposed by the side wall of the first trench and does not cover a portion of the side wall of the first trench;
a second spacer which covers the interlayer insulating film exposed by the side wall of the second trench and does not cover a portion of the side wall of the second trench;
a first barrier layer which extends along a side wall of the first spacer, the portion of the side wall of the first trench not covered by the first spacer, and a bottom surface of the first trench;
a first filling film which fills the first trench, on the first barrier layer;
a second barrier layer which extends along a side wall of the second spacer, the portion of the side wall of the second trench not covered by the second spacer, and a bottom surface of the second trench; and
a second filling film which fills the second trench, on the second barrier layer,
wherein in the first direction, a width of the first trench and a width of the second trench are different from each other, and
wherein at a first height from a bottom surface of the substrate, a thickness of the first spacer on the side wall of the first trench is different from a thickness of the second spacer on the side wall of the second trench.
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11. A semiconductor device comprising:
a via formed on a substrate;
an etching stop film disposed on the via;
an interlayer insulating film on the etching stop film;
a first trench which includes a first upper trench portion that vertically penetrates the interlayer insulating film and a part of the etching stop film, and a first lower trench portion that is connected to the first upper trench portion and vertically penetrates the remainder of the etching stop film;
a first spacer which extends along a side wall of the first upper trench portion and does not extend along a side wall of the first lower trench portion; and
a wiring which fills the first trench, on the first spacer,
wherein:
the wiring is electrically connected to the via,
the wiring extends lengthwise in a first horizontal direction,
the wiring has a first width in a second horizontal direction, which intersects the first horizontal direction,
the via has a second width in the second horizontal direction, and
the first width is greater than the second width.
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21. A semiconductor device comprising:
a first etching stop film, a second etching stop film, and a third etching stop film which are sequentially stacked on a substrate;
an interlayer insulating film on the third etching stop film;
a first trench and a second trench, which penetrate the interlayer insulating film and the first to third etching stop films, are spaced apart from each other in a first direction, and extend in a second direction that intersects the first direction;
a first spacer covering the interlayer insulating film and a side wall of the third etching stop film;
a second spacer covering the interlayer insulating film and a side wall of the third etching stop film;
a first barrier layer extending along a side wall of the first spacer and conformally disposed along the side walls and bottom surface of the first trench;
a first filling film which fills the first trench, on the first barrier layer;
a second barrier layer extending along a side wall of the second spacer and conformally disposed along the side walls and bottom surface of the second trench;
a second filling film which fills the second trench, on the second barrier layer; and
a separation layer disposed between the side wall of the first trench and the first spacer, and between the side wall of the second trench and the second spacer,
wherein:
in the first direction, a width of the first trench penetrating the first and second etching stop films is smaller than a width of the first trench penetrating the third etching stop film and the interlayer insulating film, and a width of the second trench penetrating the first and second etching stop films is smaller than a width of the second trench penetrating the third etching stop film and the interlayer insulating film,
in the first direction and at a first height above a bottom surface of the substrate, the width of the first trench is smaller than the width of the second trench, and
in the first direction and at the first height above the bottom surface of the substrate, a thickness of the first spacer on the side wall of the first trench is greater than a thickness of the second spacer on the side wall of the second trench.
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