US 12,308,300 B2
Double-sided cooling type power module
Jun Hee Park, Gyeonggi-do (KR); Tae Hwa Kim, Gyeonggi-do (KR); and Hyeon Uk Kim, Gyeonggi-do (KR)
Assigned to Hyundai Motor Company, Seoul (KR); and Kia Motors Corporation, Seoul (KR)
Filed by Hyundai Motor Company, Seoul (KR); and Kia Motors Corporation, Seoul (KR)
Filed on Aug. 18, 2020, as Appl. No. 16/996,135.
Claims priority of application No. 10-2020-0023156 (KR), filed on Feb. 25, 2020.
Prior Publication US 2021/0265235 A1, Aug. 26, 2021
Int. Cl. H01L 23/373 (2006.01); H05K 7/20 (2006.01)
CPC H01L 23/3735 (2013.01) [H01L 23/3737 (2013.01); H05K 7/209 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A double-sided cooling type power module, comprising:
an upper substrate comprising a first insulating layer, a first upper metal layer bonded to a top of the first insulating layer, and a first lower metal layer bonded to a bottom of the first insulating layer;
a lower substrate disposed under the upper substrate and comprising a second insulating layer, a second upper metal layer bonded to a top of the second insulating layer, and a second lower metal layer bonded to a bottom of the second insulating layer;
a spacer disposed between the upper substrate and the lower substrate and electrically connecting the upper substrate and the lower substrate;
a semiconductor chip disposed between the spacer and the upper substrate or between the spacer and the lower substrate,
wherein the insulating layers comprises a material of which a coefficient of thermal expansion is about 0.8 times or greater and about 1.2 times or less of coefficients of thermal expansion of the metal layers of the upper substrate and the lower substrate;
wherein the coefficients of thermal expansion of the metal layers of the upper substrate and the lower substrate are 16.5 pp/K; and
wherein a thickness of each of the spacer, the first upper and lower metal layers of the upper substrate, and the second upper and lower metal layers of the lower substrate is about 0.5 mm or greater;
a first cooler disposed outside the first upper metal layer of the upper substrate;
a second cooler disposed outside of the second lower metal layer of the lower substrate; and
a thermal interface material (TIM) disposed between at least one of the first upper metal layer and the first cooler or the second lower metal layer and the second cooler;
wherein the TIM is made of a different material from the first and second insulating layers,
wherein each of the first and second insulating layers comprises a resin material,
wherein the resin material comprises alumina (Al2O3), boron nitride (BN), and aluminum nitride (AlN), and
wherein a content of the boron nitride is greater than a content of the alumina and a content of the aluminum nitride, respectively.