US 12,308,266 B2
Semiconductor substrate boat and methods of using the same
Tung-Huang Chen, Hsinchu (TW); Chi-Hao Kung, Hsinchu (TW); and Yen-Yu Chen, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Sep. 30, 2020, as Appl. No. 17/039,356.
Prior Publication US 2022/0102175 A1, Mar. 31, 2022
Int. Cl. H01L 21/673 (2006.01); H01L 21/324 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/67323 (2013.01) [H01L 21/324 (2013.01); H01L 21/67098 (2013.01); H01L 21/67309 (2013.01); H01L 21/6875 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate boat, comprising:
a top plate;
a bottom plate; and
a plurality of boat rods extending between the top plate and the bottom plate, each of the plurality of boat rods including at least one finger, the at least one finger including:
a first portion that includes a first end adjacent the respective boat rod, the first portion extends inward toward a center of the substrate boat from the respective boat rod, the first portion including a second end opposite the first end, and the first portion of the finger comprising a no-contact top surface which, in operation, does not contact a backside of a substrate;
a plurality of second portions that each extends inward toward the center of the substrate boat from the second end of the first portion, the plurality of second portions comprising respective planar substrate contact surfaces, which, in operation, contact the backside of the substrate; and
one or more substrate no-contact regions, each of the one or more substrate no-contact regions comprising a void space located laterally between adjacent ones of the second portions, in operation, the one or more substrate no-contact regions are overlapped by the substrate.