US 12,308,215 B2
Semiconductor manufacturing apparatus member and semiconductor manufacturing apparatus
Ryunosuke Nakagawa, Kitakyushu (JP); Nobutomo Otsuka, Kitakyushu (JP); and Tatsuya Koga, Kitakyushu (JP)
Assigned to Toto, Ltd., Fukuoka (JP)
Filed by TOTO LTD., Kitakyushu (JP)
Filed on Mar. 23, 2022, as Appl. No. 17/701,813.
Claims priority of application No. 2021-072039 (JP), filed on Apr. 21, 2021; and application No. 2022-011203 (JP), filed on Jan. 27, 2022.
Prior Publication US 2022/0351944 A1, Nov. 3, 2022
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/32495 (2013.01) [H01J 37/32467 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A semiconductor manufacturing apparatus member used inside a chamber of a semiconductor manufacturing apparatus, the semiconductor manufacturing apparatus member comprising:
a base material including
a first surface,
a second surface at a side opposite to the first surface, and
at least one hole extending through the first and second surfaces; and
a ceramic layer located on the base material,
the at least one hole including a first hole part continuous with the first surface,
the ceramic layer including
a first part located on the first surface, the first part being exposed, and
a second part located on the first hole part,
an arithmetical mean height Sa of a surface of the first part being less than an arithmetical mean height Sa of a surface of the second part,
wherein the arithmetical mean height Sa of the surface of the first part is a surface roughness of the surface of the first part; and the arithmetical mean height Sa of the surface of the second part is a surface roughness of the surface of the second part.