US 12,308,154 B2
Apparatus for power module and heat dissipation of an integrated circuit
Dhammika L. Perera, San Jose, CA (US); John Weld, Ledgewood, NJ (US); and Matthew Wilkowski, Rockwall, TX (US)
Assigned to MODULAR POWER TECHNOLOGY, INC., Sunnyvale, CA (US)
Filed by MODULAR POWER TECHNOLOGY, INC., Sunnyvale, CA (US)
Filed on Oct. 6, 2021, as Appl. No. 17/495,174.
Claims priority of provisional application 63/105,567, filed on Oct. 26, 2020.
Prior Publication US 2022/0132695 A1, Apr. 28, 2022
Int. Cl. H01F 27/22 (2006.01); H01F 1/147 (2006.01); H01F 1/34 (2006.01); H01F 27/24 (2006.01); H01F 27/28 (2006.01); H02M 1/00 (2006.01); H05K 7/12 (2006.01); H05K 7/20 (2006.01); H10D 89/60 (2025.01)
CPC H01F 27/22 (2013.01) [H01F 1/147 (2013.01); H01F 1/344 (2013.01); H01F 27/24 (2013.01); H01F 27/2876 (2013.01); H02M 1/0003 (2021.05); H05K 7/12 (2013.01); H05K 7/209 (2013.01); H10D 89/60 (2025.01); H05K 2201/1003 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A method of dissipating heat from an integrated circuit die using a band at least partially disposed around an inductor comprising:
elevating the band over the integrated circuit die by at least a thickness of a thermal interface, wherein a bottom side of the band at least partially overlaps the integrated circuit die;
collecting, at a bottom side of the band, heat radiated from a surface of the integrated circuit die via the thermal interface, wherein an opposite side of the integrated circuit is mounted on a substrate; and
conducting the heat from the bottom side of the band to a top side of the band, wherein the band disposed at least partially around the inductor comprises a thermally conductive material.