US 12,306,595 B1
Laser packaging system and intelligent heat dissipation method thereof
Yi An, Guangdong (CN); Qi Chen, Guangdong (CN); Taimeng Qin, Guangdong (CN); and Wei Chen, Guangdong (CN)
Assigned to Dongguan Pepper Gray Technology Co., Ltd., Dongguan (CN); and Shenzhen Pepper Gray Technology Co., Ltd., Shenzhen (CN)
Filed by Dongguan Pepper Gray Technology Co., Ltd., Guangdong (CN); and Shenzhen Pepper Gray Technology Co., Ltd., Guangdong (CN)
Filed on Dec. 19, 2024, as Appl. No. 18/987,438.
Application 18/987,438 is a continuation of application No. PCT/CN2024/121780, filed on Sep. 27, 2024.
Claims priority of application No. 202311805897.0 (CN), filed on Dec. 26, 2023.
Int. Cl. G05B 13/02 (2006.01); H01S 5/024 (2006.01)
CPC G05B 13/027 (2013.01) [H01S 5/02423 (2013.01); H01S 5/02469 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A laser packaging system, comprising:
a laser array module, having a plurality of lasers arranged at intervals and distributed in an array, each of the lasers having a heat sink for conducting heat, and each heat sink being provided with a Thermoelectric Cooler (TEC) semiconductor refrigerator for dissipating heat from the laser;
a training module, configured to acquire a measured temperature of the laser within a specific time period and historical operating state data at a corresponding moment to generate a database, and divide the database into training data and verification data; train a deep learning model based on the training data, and verify the trained deep learning model based on the verification data; if a difference between a predicted temperature output by the verification and a corresponding measured temperature is within a first preset interval, output the trained deep learning model;
a prediction module, configured to detect a first parameter and a second parameter of the laser in real time and input the first parameter and the second parameter into the trained deep learning model so as to generate a predicted temperature corresponding to the laser; wherein the first parameter comprises power, and the second parameter comprises a running time; and
a temperature adjusting module, configured to control the TEC semiconductor refrigerator to adjust a current temperature of the laser based on the predicted temperature.