US 12,306,545 B2
Determining lithographic matching performance
Yingchao Cui, Eindhoven (NL); Hadi Yagubizade, Eindhoven (NL); Xiuhong Wei, Eindhoven (NL); Daan Maurits Slotboom, Wolphaartsdijk (NL); Jeonghyun Park, Eindhoven (NL); Sarathi Roy, Eindhoven (NL); Yichen Zhang, Eindhoven (NL); Mohammad Reza Kamali, Eindhoven (NL); and Sang Uk Kim, Yong-In (KR)
Assigned to ASML NETHERLANDS B.V., Veldhoven (NL)
Appl. No. 17/640,880
Filed by ASML NETHERLANDS B.V., Veldhoven (NL)
PCT Filed Aug. 11, 2020, PCT No. PCT/EP2020/072473
§ 371(c)(1), (2) Date Mar. 7, 2022,
PCT Pub. No. WO2021/047841, PCT Pub. Date Mar. 18, 2021.
Claims priority of application No. 19196849 (EP), filed on Sep. 12, 2019; application No. 19198515 (EP), filed on Sep. 20, 2019; and application No. 20166146 (EP), filed on Mar. 27, 2020.
Prior Publication US 2022/0334503 A1, Oct. 20, 2022
Int. Cl. G03F 7/00 (2006.01)
CPC G03F 7/70633 (2013.01) [G03F 7/70525 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of determining lithographic matching performance between lithographic apparatuses for semiconductor manufacturing, the method comprising:
obtaining first monitoring data in a first layout from recurrent monitoring for stability control of a first lithographic apparatus;
obtaining second monitoring data in a second layout from recurrent monitoring for stability control of a second lithographic apparatus; and
determining a lithographic matching performance between the first lithographic apparatus and the second lithographic apparatus based on the first monitoring data and the second monitoring data, wherein the determining comprises reconstructing, by a hardware computer system, the first and/or second monitoring data into a common spatial layout to allow comparison of the first and second monitoring data.