	US 12,306,542 B2
	Immersion exposure tool
Yung-Yao Lee, Zhubei (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Mar. 19, 2024, as Appl. No. 18/609,433.
Application 18/609,433 is a continuation of application No. 17/248,394, filed on Jan. 22, 2021, granted, now 11,966,165.
Prior Publication US 2024/0231240 A1, Jul. 11, 2024
Int. Cl. G03F 7/00 (2006.01); C09D 1/00 (2006.01); C09D 5/00 (2006.01); C23C 14/06 (2006.01); C23C 14/08 (2006.01); C23C 16/34 (2006.01); C23C 16/40 (2006.01)

CPC G03F 7/70316 (2013.01) [C09D 1/00 (2013.01); C09D 5/00 (2013.01); C23C 14/0652 (2013.01); C23C 14/0694 (2013.01); C23C 14/08 (2013.01); C23C 16/345 (2013.01); C23C 16/40 (2013.01); G03F 7/70341 (2013.01)]

20 Claims

1. A method, comprising:

providing a processing fluid to a processing area of an immersion exposure tool; and

transmitting radiation through a bottom lens of the immersion exposure tool and through the processing fluid, to a wafer, under the processing area,

wherein the bottom lens comprises:

an upper portion comprising straight sidewalls and straight bottom walls connecting to the straight sidewalls, and

a lower portion comprising tapered sidewalls extending from the straight bottom walls,

wherein the tapered sidewalls, and at least one of the straight sidewalls or the straight bottom walls, comprise a hydrophobic coating.