US 12,306,434 B2
Photonic wafer communication systems and related packages
Sukeshwar Kannan, Chelmsford, MA (US); Carl Ramey, Westborough, MA (US); Jon Elmhurst, East Walpole, MA (US); Darius Bunandar, Boston, MA (US); and Nicholas C. Harris, Menlo Park, CA (US)
Assigned to Lightmatter, Inc., Boston, MA (US)
Filed by Lightmatter, Inc., Boston, MA (US)
Filed on Feb. 6, 2024, as Appl. No. 18/434,443.
Application 18/434,443 is a continuation of application No. 17/165,157, filed on Feb. 2, 2021, granted, now 11,947,164.
Claims priority of provisional application 63/087,052, filed on Oct. 2, 2020.
Claims priority of provisional application 62/969,373, filed on Feb. 3, 2020.
Prior Publication US 2024/0176066 A1, May 30, 2024
Int. Cl. G02B 6/12 (2006.01); G02B 6/42 (2006.01); H01L 23/13 (2006.01); H01L 23/50 (2006.01); H01L 23/538 (2006.01); H01L 25/16 (2023.01); H05K 1/18 (2006.01)
CPC G02B 6/12 (2013.01) [H01L 23/50 (2013.01); H05K 1/183 (2013.01); G02B 6/4274 (2013.01); H01L 23/13 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 23/5385 (2013.01); H01L 25/167 (2013.01); H01L 2924/15153 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A photonic package comprising:
a substrate carrier having a first surface and a second surface opposite the first surface;
a plurality of contact pads disposed on the first surface of the substrate carrier;
a first plurality of electrical connections extending from the plurality of contact pads through the substrate carrier;
a photonic substrate disposed on the substrate carrier;
an electronic die; and
an interposer, disposed between the photonic substrate and the electronic die, having a second plurality of electrical connections coupled with the first plurality of electrical connections, the second plurality of electrical connections comprising:
a first subset of the second plurality of electrical connections extending from the first plurality of electrical connections on a first side of the interposer to a second side of the interposer and configured to convey electric power from the substrate carrier to the electronic die; and
a second subset of the second plurality of electrical connections extending from the first plurality of electrical connections on the first side of the interposer to the photonic substrate on the first side of the interposer and configured to convey electric power from the substrate carrier to the photonic substrate.