US 12,306,210 B2
Multilayer circuit board with offset connection pads and inclined internal conductors for enhanced electrical connectivity
Hitoshi Tega, Kyoto (JP)
Assigned to KYOCERA Corporation, Kyoto (JP)
Appl. No. 18/017,128
Filed by KYOCERA Corporation, Kyoto (JP)
PCT Filed Jul. 28, 2021, PCT No. PCT/JP2021/027932
§ 371(c)(1), (2) Date Jan. 20, 2023,
PCT Pub. No. WO2022/025128, PCT Pub. Date Feb. 3, 2022.
Claims priority of application No. 2020-127820 (JP), filed on Jul. 29, 2020.
Prior Publication US 2023/0266363 A1, Aug. 24, 2023
Int. Cl. G01R 1/073 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01)
CPC G01R 1/07342 (2013.01) [H05K 1/025 (2013.01); H05K 1/0298 (2013.01); H05K 1/119 (2013.01); H05K 2201/09445 (2013.01); H05K 2201/09609 (2013.01); H05K 2201/09672 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A circuit board comprising:
an insulating substrate including a wiring conductor;
a first resin substrate that is made of a resin different from the insulating substrate and is laminated on the insulating substrate in a thickness direction, wherein the first resin substrate extends along a first direction that is orthogonal to the thickness direction;
a first plurality of connection pads;
a second plurality of connection pads that face the insulating substrate, wherein the first plurality of connection pads are offset in a thickness direction of the first resin substrate; and
a plurality of internal conductors formed in the first resin substrate that each electrically connect a respective first connection pad among the first plurality of connection pads and a respective second connection pad among the second plurality of connection pads,
wherein each of the plurality of internal conductors includes:
a first part that electrically couples to the first respective connection pad and is inclined with respect to the thickness direction
wherein the plurality of internal conductors includes internal conductors that further include:
a second part that electrically couples to the second respective connection pad and extends along the thickness direction, wherein a length of the second part in the thickness direction increases as a distance along the first direction from a respective internal conductor to a center of the first resin substrate increases, and
wherein a distance separating each of the first plurality of connection pads along a side opposite to the insulating substrate in the first direction is narrower than a distance separating each of the second plurality of connection pads in the first direction.