US 12,306,050 B2
Pressure sensor device, pressure sensor module, and signal correction method for pressure sensor module
Hideaki Sugibayashi, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Dec. 22, 2022, as Appl. No. 18/086,710.
Application 18/086,710 is a continuation of application No. PCT/JP2021/022241, filed on Jun. 11, 2021.
Claims priority of application No. 2020-116547 (JP), filed on Jul. 6, 2020.
Prior Publication US 2023/0130920 A1, Apr. 27, 2023
Int. Cl. G01L 1/14 (2006.01); G01L 25/00 (2006.01); H05K 1/18 (2006.01)
CPC G01L 1/144 (2013.01) [G01L 25/00 (2013.01); H05K 1/181 (2013.01); H05K 2201/10151 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A pressure sensor device to detect a change in capacitance between electrodes, comprising:
a base electrode portion;
a sensing electrode portion defining a sensing capacitor together with the base electrode portion and that is deformable in response to an ambient pressure difference;
a spacer portion maintaining a gap between the base electrode portion and the sensing electrode portion; and
a monitoring electrode portion defining a monitoring capacitor together with the base electrode portion to detect at least one of stress or strain occurring in or on the spacer portion; wherein
the sensing electrode portion includes a sensing electrode that is rectangular or oblong in a plan view; and
the monitoring electrode portion includes first and second monitoring electrodes respectively provided in left and right outer side portions or in upper and lower outer side portions of the sensing electrode, and the first and second monitoring electrodes are separated from one another in the plan view.