US 12,305,713 B2
Sensor module
Atsuto Yoda, Nagano (JP); and Takumi Ikeda, Nagano (JP)
Assigned to SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed by SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed on Jul. 25, 2022, as Appl. No. 17/814,630.
Claims priority of application No. 2021-126001 (JP), filed on Jul. 30, 2021.
Prior Publication US 2023/0037144 A1, Feb. 2, 2023
Int. Cl. F16C 41/00 (2006.01); F16C 17/24 (2006.01); G01M 13/04 (2019.01); G08C 17/02 (2006.01)
CPC F16C 41/008 (2013.01) [F16C 17/24 (2013.01); G01M 13/04 (2013.01); G08C 17/02 (2013.01); F16C 2233/00 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A sensor module comprising:
a metal member having a side surface extending in a ring shape, and an annular recess recessed from the side surface toward a center portion of the metal member and extending along the side surface;
a resin part filling an inside of the annular recess; and
a multi-module having a wiring board, a radiating part provided on the wiring board and configured to emit radio waves, a radio communication device provided on the wiring board and electrically connected to the radiating part, and a sensor provided on the wiring board and electrically connected to the radio communication device, wherein:
the resin part covers the multi-module and completely fills an inside of the annular recess of the metal member to encapsulate the multi-module, and insulate the metal member from the radiating part,
the metal member has an inner peripheral wall defining a through hole which penetrates the center portion of the metal member, and upper and lower inner walls and a surface of a bottom part defining the annular recess,
the bottom part of the metal member is located at a bottom of the annular recess when viewed in a radial direction from the side surface of the metal member toward the center portion of the metal member,
the upper and lower inner walls of the metal member are parallel to each other, oppose each other, and connect to the surface of the bottom part of the metal member,
the inner peripheral wall is located at a position closer to the center portion of the metal member than the surface of the bottom part is to the center portion of the metal member in the radial direction,
the wiring board has a ring shape with an opening at a center portion thereof in a plan view, and
a diameter of the opening of the wiring board is greater than a diameter of the bottom part of the annular recess of the metal member in the plan view, and a diameter of an outer periphery of the wiring board is smaller than a diameter of an outer periphery of the metal member forming the side surface in the plan view.