	US 12,305,269 B2
	Method of manufacturing sheet material made of copper-silver alloy and method of manufaturing sheet for electrode of probe card
Tsutomu Koizumi, Kanagawa (JP); Go Odachi, Kanagawa (JP); and Ryuichi Arai, Kanagawa (JP)
Assigned to SWCC Corporation, Kanagawa (JP)
Filed by SWCC Corporation, Kanagawa (JP)
Filed on Oct. 31, 2024, as Appl. No. 18/932,615.
Application 18/932,615 is a continuation of application No. PCT/JP2023/035495, filed on Sep. 28, 2023.
Prior Publication US 2025/0109470 A1, Apr. 3, 2025
Int. Cl. C22F 1/08 (2006.01); B22D 11/00 (2006.01); C22C 9/00 (2006.01); G01N 27/30 (2006.01)

CPC C22F 1/08 (2013.01) [B22D 11/004 (2013.01); C22C 9/00 (2013.01); G01N 27/30 (2013.01)]

8 Claims

1. A method of manufacturing a sheet material made of a copper-silver alloy, the method comprising the steps of:

(a) casting continuously the copper-silver alloy so as to obtain a base material having a thickness or a diameter within a range of 6 to 30 mm, wherein the copper-silver alloy, to be casted continuously, consists of: copper within a range of 70 to 92 mass %; silver within a range of 8 to 30 mass %; and a balance including unavoidable impurities within a range of 0 to 1 mass %;

(b) rolling the base material at least once so as to obtain the sheet material having a thickness within a range of 0.01 to 0.10 mm; and

wherein the sheet material having undergone step (c) has an electrical conductivity of 38% IACS or higher and a Vickers hardness of 280 HV or higher.