US 12,305,094 B2
Pressure-sensitive adhesive tape
Daisuke Watanabe, Saitama (JP); Kota Suetsugu, Saitama (JP); and Akira Yamakami, Saitama (JP)
Assigned to DIC Corporation, Tokyo (JP)
Filed by DIC Corporation, Tokyo (JP)
Filed on Jul. 20, 2022, as Appl. No. 17/869,376.
Application 17/869,376 is a continuation of application No. PCT/JP2021/000941, filed on Jan. 14, 2021.
Claims priority of application No. 2020-007905 (JP), filed on Jan. 21, 2020.
Prior Publication US 2022/0372342 A1, Nov. 24, 2022
Int. Cl. B32B 41/00 (2006.01); C09J 7/24 (2018.01); C09J 7/38 (2018.01); C09J 11/08 (2006.01); C09J 133/08 (2006.01); C09J 133/10 (2006.01)
CPC C09J 7/385 (2018.01) [C09J 7/245 (2018.01); C09J 11/08 (2013.01); C09J 133/08 (2013.01); C09J 133/10 (2013.01); C09J 2301/302 (2020.08); C09J 2301/408 (2020.08); C09J 2453/006 (2013.01)] 11 Claims
 
1. An adhesive tape comprising:
a substrate layer; and
an adhesive layer comprising a filler,
wherein:
the substrate layer has a breaking stress in a range of 1 to 100 MPa and an elongation at break in a range of 300% to 3000%,
the adhesive layer contains a tackifier resin and a triblock copolymer with a repeating unit represented by the general formula (1):

OG Complex Work Unit Chemistry
A, B, and C independently denote a repeating unit,
A and C independently denote an alkyl methacrylate monomer unit,
B denotes an alkyl acrylate monomer unit,
p, q, and r independently denote a degree of polymerization of monomer units respectively,
A and C are the same or denote an alkyl methacrylate monomer unit with a different chemical structure,
* denotes a bonding arm to another atom,
a content of the triblock copolymer in the adhesive layer is in a range of 30% to 100% by mass, and
a particle size distribution D90/D10 of the filler is in a range of 2.5 to 20.