US 12,305,081 B2
Polishing composition
Takashi Murakami, Osaka (JP); and Yoshihiro Kimura, Osaka (JP)
Assigned to JAPAN VAM & POVAL CO., LTD., Osaka (JP)
Appl. No. 17/793,260
Filed by JAPAN VAM & POVAL CO., LTD., Osaka (JP)
PCT Filed Jan. 22, 2021, PCT No. PCT/JP2021/002202
§ 371(c)(1), (2) Date Jul. 15, 2022,
PCT Pub. No. WO2021/149791, PCT Pub. Date Jul. 29, 2021.
Claims priority of application No. 2020-008077 (JP), filed on Jan. 22, 2020; and application No. 2020-027612 (JP), filed on Feb. 20, 2020.
Prior Publication US 2023/0055305 A1, Feb. 23, 2023
Int. Cl. C09G 1/02 (2006.01); H01L 21/306 (2006.01)
CPC C09G 1/02 (2013.01) [H01L 21/30625 (2013.01)] 25 Claims
 
1. A polishing composition comprising a water-soluble polymer, wherein the water-soluble polymer at least comprises a vinyl alcohol-based resin (A) having a side-chain group of 3 carbon atoms or more, and
wherein the side-chain group comprises at least one group selected from the group consisting of a group derived from a C7-30 fatty acid vinyl ester, a group derived from a C3-30 alkyl vinyl ether, a group derived from an aromatic carboxylic acid vinyl ester, a group derived from diacetone (meth)acrylamide, an acetoacetyl group, an epoxy ring-opening product of a group derived from an epoxy group-containing vinyl monomer, and a polyoxyethylene group.