	US 12,305,057 B2
	Conductive resin composition
Masayuki Sasaki, Osaka (JP); Yuki Shirakawa, Osaka (JP); Ko Fukushima, Osaka (JP); and Kaori Fujii, Osaka (JP)
Assigned to SAKATA INX CORPORATION, Osaka (JP)
Appl. No. 18/272,061
Filed by SAKATA INX CORPORATION, Osaka (JP)
PCT Filed Oct. 28, 2021, PCT No. PCT/JP2021/039728 § 371(c)(1), (2) Date Jul. 12, 2023, PCT Pub. No. WO2022/163045, PCT Pub. Date Aug. 4, 2022.
Claims priority of application No. 2021-010907 (JP), filed on Jan. 27, 2021; and application No. 2021-092292 (JP), filed on Jun. 1, 2021.
Prior Publication US 2024/0084154 A1, Mar. 14, 2024
Int. Cl. C09D 11/52 (2014.01); C09D 11/037 (2014.01); C09D 11/106 (2014.01); H05K 1/09 (2006.01)

CPC C09D 11/52 (2013.01) [C09D 11/037 (2013.01); C09D 11/106 (2013.01); H05K 1/092 (2013.01)]

3 Claims

1. A conductive resin composition containing:

(a) conductive powder consisting of silver-coated copper powder alone or a mixture of silver-coated copper powder and silver powder; and

(b) a polyvinyl butyral-based resin; and

also containing:

(c) a resol-type phenol-based resin by 0 to 75 parts by mass relative to 100 parts by mass of the polyvinyl butyral-based resin,

wherein a content of the polyvinyl butyral-based resin is 2.0% by mass or more and 25.0% by mass or less, relative to a total amount of the conductive powder, polyvinyl butyral-based resin, and resol-type phenol-based resin, which represents 100% by mass.