US 12,305,053 B2
Conductive ink composition
Do Young Byun, Seoul (KR); and Won Il Son, Daejeon (KR)
Assigned to ENJET CO. LTD., Suwon-si (KR)
Filed by ENJET CO. LTD., Gyeonggi-do (KR)
Filed on Mar. 4, 2021, as Appl. No. 17/191,800.
Claims priority of application No. 10-2020-0027874 (KR), filed on Mar. 5, 2020.
Prior Publication US 2021/0277270 A1, Sep. 9, 2021
Int. Cl. C09D 11/52 (2014.01); C09D 11/037 (2014.01); C09D 11/102 (2014.01); C09D 11/322 (2014.01); H01B 1/22 (2006.01)
CPC C09D 11/52 (2013.01) [C09D 11/037 (2013.01); C09D 11/102 (2013.01); C09D 11/322 (2013.01); H01B 1/22 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A conductive ink composition that can be printed on a substrate, the conductive ink composition comprising:
a first metal precursor solution comprising a first metal ion; and
a photothermal material;
a binder for immobilizing the conductive ink composition on a substrate;
a curing agent for reacting with the binder and curing the binder; and
a curing accelerator for accelerating reaction of the binder and the curing agent,
wherein the first metal precursor solution further comprises a second metal precursor comprising a second metal ion,
wherein the first metal is silver (Ag),
wherein the second metal is Bismuth (Bi),
wherein the binder included is 7 to 50 parts by weight of 100 parts by weight of the first metal precursor solution,
wherein the curing accelerator included is 0.1 to 17 parts by weight of 100 parts by weight of the first metal precursor solution.