US 12,304,809 B2
Bond force concentrator
Elmeri Österlund, Espoo (FI); and Hannu Manninen, Espoo (FI)
Assigned to KYOCERA Technologies Oy, Espoo (FI)
Filed by KYOCERA Technologies Oy, Espoo (FI)
Filed on Oct. 28, 2024, as Appl. No. 18/928,253.
Claims priority of application No. 20236204 (FI), filed on Oct. 30, 2023.
Prior Publication US 2025/0136438 A1, May 1, 2025
Int. Cl. B81C 1/00 (2006.01); B23K 20/02 (2006.01)
CPC B81C 1/00269 (2013.01) [B23K 20/023 (2013.01); B81C 2203/0118 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for bonding a first substrate with a second substrate, comprising the steps of:
providing a first substrate and a second substrate;
bonding the first substrate and the second substrate together using a rectangular bond force concentrator to form a bond, wherein the first substrate or the second substrate comprises a device; and
finishing the fabricating of said rectangular bond force concentrator before finishing of fabricating said device.
 
13. An apparatus obtained via the method according to claim 1, comprising a first substrate and a second substrate bonded together using a rectangular bond force concentrator to form a bond, wherein the first substrate or the second substrate comprises the rectangular bond force concentrator and/or a device.
 
17. A method for bonding a first substrate with a second substrate, comprising the steps of:
providing a first substrate and a second substrate; and
bonding the first substrate and the second substrate together using a rectangular bond force concentrator to form a bond, wherein the first substrate or the second substrate comprises a device,
wherein said bonding comprises a first stage, in which high pressure is provided via the bond force concentrator, and a second stage, in which said bonding is completed via low pressure.