US 12,304,180 B2
Low surface roughness thermal interface device based on graphite with branched siloxane having high through-plane thermal conductivity
Jinliang Zhao, Hong Kong (HK); Yijun Liao, Hong Kong (HK); ChiHo Kwok, Hong Kong (HK); and Chenmin Liu, Hong Kong (HK)
Assigned to Nano and Advanced Materials Institute Limited, Hong Kong (HK)
Filed by Nano and Advanced Materials Institute Limited, Hong Kong (HK)
Filed on Aug. 15, 2022, as Appl. No. 17/888,468.
Application 17/888,468 is a continuation in part of application No. 17/530,483, filed on Nov. 19, 2021.
Claims priority of provisional application 63/262,562, filed on Oct. 15, 2021.
Claims priority of provisional application 63/118,021, filed on Nov. 25, 2020.
Prior Publication US 2023/0182453 A1, Jun. 15, 2023
Int. Cl. B32B 27/08 (2006.01); B32B 7/03 (2019.01); B32B 27/20 (2006.01); B32B 27/28 (2006.01); B32B 37/10 (2006.01); B32B 37/20 (2006.01); B32B 38/00 (2006.01)
CPC B32B 27/08 (2013.01) [B32B 7/03 (2019.01); B32B 27/20 (2013.01); B32B 27/283 (2013.01); B32B 37/10 (2013.01); B32B 37/203 (2013.01); B32B 38/0004 (2013.01); B32B 2038/0064 (2013.01); B32B 2264/108 (2013.01); B32B 2305/30 (2013.01); B32B 2307/302 (2013.01); B32B 2307/536 (2013.01); B32B 2307/538 (2013.01); B32B 2307/54 (2013.01); B32B 2313/04 (2013.01); B32B 2383/00 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A low surface roughness anisotropic thermal interface device comprising:
plural aligned thermally anisotropic conductive composite layers having a first thermal conductivity in a first direction and a second, larger thermal conductivity in a second direction, the aligned thermally conductive composite layers extending substantially parallel to each other in the first direction;
each of the thermally anisotropic conductive composite layers including 70-95 weight percent thermal filler, wherein the thermal filler includes macro graphite flakes in an amount from 45-95 weight percent, the graphite flakes having a size of approximately 0.5 mm to 1.0 mm, the graphite flakes being aligned in the second direction approximately perpendicular to the first direction such that x-y planes of the flakes align in the second direction having the second, larger thermal conductivity, the thermally anisotropic conductive composite layers having a binder including a linear siloxane and a branched siloxane, the binder having a total weight percent of approximately 5 to approximately 25 weight percent;
the thermally anisotropic conductive composite layers being adhered to adjacent thermally anisotropic conductive composite layers to create a laminated anisotropic composite thermal interface device;
the anisotropic thermal interface device having an arithmetic average surface roughness of approximately 5 to 20 μm and a tensile strength of approximately 50 to 130 KPa and a thermal conductivity of 25 to 45 W/mK.