| CPC B29C 51/14 (2013.01) [B29C 51/10 (2013.01); B32B 27/08 (2013.01); B32B 27/304 (2013.01); B32B 27/308 (2013.01); B32B 27/365 (2013.01); B29K 2033/12 (2013.01); B29K 2067/003 (2013.01); B29K 2069/00 (2013.01); B29K 2995/0029 (2013.01); B29L 2011/00 (2013.01); B32B 2250/03 (2013.01); B32B 2250/24 (2013.01); B32B 2307/414 (2013.01); B32B 2307/732 (2013.01); B32B 2551/00 (2013.01); G02B 5/0268 (2013.01)] | 20 Claims |

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1. A method of thermoforming a rigid film construction, comprising:
applying a rigid film construction to a mold; and
heating the rigid film construction until it conforms to the mold;
wherein the rigid film construction comprises:
a rigid polymeric film layer having a thickness of approximately 1 mm to 5 mm;
a light-modifying film layer; and
a shielding film layer,
wherein the shielding film comprises polymethyl methacrylate (PMMA); and
wherein the shielding film layer contacts a convex surface of the mold.
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