US 12,304,110 B2
Peeling method and peeling apparatus
Ryohei Yamamoto, Tokyo (JP); Koyo Honoki, Tokyo (JP); and Koji Itabashi, Tokyo (JP)
Assigned to DISCO CORPORATION, Tokyo (JP)
Filed by DISCO CORPORATION, Tokyo (JP)
Filed on May 23, 2022, as Appl. No. 17/664,478.
Claims priority of application No. 2021-087328 (JP), filed on May 25, 2021.
Prior Publication US 2022/0379520 A1, Dec. 1, 2022
Int. Cl. B28D 5/00 (2006.01); B23K 26/53 (2014.01); B23K 103/00 (2006.01)
CPC B28D 5/0011 (2013.01) [B23K 26/53 (2015.10); B28D 5/0052 (2013.01); B23K 2103/50 (2018.08)] 9 Claims
OG exemplary drawing
 
1. A peeling method for separating a cylindrical ingot that has a peel-off layer formed therein at the peel-off layer and peeling off a disk-shaped wafer from the ingot, the peeling method comprising:
an ultrasonic wave applying step of applying an ultrasonic wave to an upper surface of the ingot via a liquid layer supplied to the upper surface of the ingot from an ultrasonic wave applying unit, in a state in which an outer circumferential region of a lower surface of the ingot is sucked on a holding surface of a chuck table and a lower side around an outer circumferential arc-shaped portion of the lower surface of the ingot has a radius approximately equal to an outer radius of the holding surface, wherein the liquid layer is supplied to the upper surface of the ingot from an opening of an ultrasonic nozzle of the ultrasonic wave applying unit.