US 12,304,029 B2
Grinding wheel
Masaru Nagami, Tokyo (JP)
Assigned to DISCO CORPORATION, Tokyo (JP)
Filed by DISCO CORPORATION, Tokyo (JP)
Filed on Nov. 8, 2022, as Appl. No. 18/053,541.
Claims priority of application No. 2021-191151 (JP), filed on Nov. 25, 2021.
Prior Publication US 2023/0158640 A1, May 25, 2023
Int. Cl. B24D 7/06 (2006.01); B24B 7/22 (2006.01)
CPC B24D 7/066 (2013.01) [B24B 7/228 (2013.01)] 2 Claims
OG exemplary drawing
 
1. A grinding method of grinding a workpiece having a single crystal substrate formed with a non-single crystal layer on a front surface of the substrate, with use of a grinding wheel,
the grinding wheel including
an annular base, and
a plurality of grindstone sets disposed in an annular manner on one surface side of the base along a circumferential direction of the base,
in which each of the plurality of grindstone sets has a first grindstone and a second grindstone having a self-sharpening capability lower than that of the first grindstone, such that the first grindstone and the second grindstone are adjacent to each other in a predetermined orientation in the circumferential direction of the base, and
a predetermined interval larger than an interval between the first grindstone and the second grindstone in the circumferential direction of the base is provided between adjacent ones of the grindstone sets,
the grinding method comprising:
a holding step of holding under suction, on a chuck table, a back surface of the substrate that is positioned opposite to the front surface of the substrate;
a first grinding step of rotating a spindle in a predetermined direction such that the second grindstone is set in front of the first grindstone in each of the grindstone sets, to grind the front surface of the substrate, thereby removing the non-single crystal layer, after the holding step is carried out; and
a second grinding step of rotating the spindle in a direction opposite to the predetermined direction such that the first grindstone is set in front of the second grindstone in each of the grindstone sets, to grind the substrate, after the first grinding step is carried out.