US 12,304,027 B2
Grinding apparatus and use method of grinding apparatus
Tomotaka Tabuchi, Tokyo (JP); Yuannan Li, Tokyo (JP); and Kazuma Sekiya, Tokyo (JP)
Assigned to DISCO CORPORATION, Tokyo (JP)
Filed by DISCO CORPORATION, Tokyo (JP)
Filed on Jun. 9, 2020, as Appl. No. 16/896,397.
Claims priority of application No. 2019-111905 (JP), filed on Jun. 17, 2019.
Prior Publication US 2020/0391337 A1, Dec. 17, 2020
Int. Cl. B24B 7/22 (2006.01); B24B 7/04 (2006.01); B24B 7/06 (2006.01); B24B 7/20 (2006.01); B24B 41/02 (2006.01); B24B 41/06 (2012.01)
CPC B24B 7/228 (2013.01) [B24B 7/04 (2013.01); B24B 7/06 (2013.01); B24B 7/20 (2013.01); B24B 41/02 (2013.01); B24B 41/06 (2013.01)] 3 Claims
OG exemplary drawing
 
1. A grinding apparatus comprising:
a first chuck table that has a first frame body and a first porous member that includes a first porous holding surface corresponding to a first wafer and holds the first wafer;
a second chuck table that has a second frame body and a second porous member that includes a second porous holding surface corresponding to a second wafer different from the first wafer in size or shape and holds the second wafer, wherein the second porous member is different in size or shape from the first porous member;
a turntable that supports each of the first chuck table and the second chuck table in a rotatable state and positions the first chuck table to a conveyance position to which the first wafer is conveyed and a grinding position at which the first wafer is ground and positions the second chuck table to the conveyance position to which the second wafer is conveyed and the grinding position at which the second wafer is ground; and
a grinding unit that grinds, by a grinding wheel, the first wafer sucked and held by the first chuck table positioned at the grinding position or the second wafer sucked and held by the second chuck table positioned at the grinding position.