US 12,304,024 B2
Polishing tool
Naruto Fuwa, Tokyo (JP); and Naoya Sukegawa, Tokyo (JP)
Assigned to DISCO CORPORATION, Tokyo (JP)
Filed by DISCO CORPORATION, Tokyo (JP)
Filed on Jun. 2, 2022, as Appl. No. 17/805,156.
Claims priority of application No. 2021-098441 (JP), filed on Jun. 14, 2021.
Prior Publication US 2022/0395957 A1, Dec. 15, 2022
Int. Cl. B24B 37/22 (2012.01)
CPC B24B 37/22 (2013.01) 19 Claims
OG exemplary drawing
 
1. A polishing tool for polishing a wafer, comprising:
a disc-shaped base that is configured and arranged to be rotated; and
a polishing layer fixed to the disc-shaped base,
wherein the polishing layer includes an electrically conductive material that is dispersed throughout an entirety of the polishing layer to eliminate static electricity generated when the polishing layer comes into contact with the wafer,
wherein the electrically conductive material comprises carbon fiber, and the carbon fiber is included at a content of 3 wt % or more but 15 wt % or less, and
wherein a portion of the electrically conductive material is exposed on an upper surface of the polishing layer, a portion of the electrically conductive material is exposed on a lower surface of the polishing layer, and the electrically conductive material within the polishing layer forms an electrically conductive path between the portion of the electrically conductive material exposed on the upper surface of the polishing layer and the portion of the electrically conductive material exposed on the lower surface of the polishing layer, and
wherein an outer diameter of the upper surface of the polishing layer and an outer diameter of the lower surface of the polishing layer are both substantially the same as an outer diameter of the disc-shaped base.